Latest Whitepapers
Virtium TuffDrive® PATA SSDs
Virtium TuffDrive Parallel ATA (PATA) solid state drives (SSDs) are direct replacements for legacy PATA...
eGaN® FETs in High Frequency Resonant Converters
In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously,...
Fundus Examination Device
A fundus examination device uses what's known as a fundus camera to view behind the pupil. It is used...
The problems with tinning wires
Many companies and manufacturers use the practice of solder-dipping wire ends, but this can lead to loose...
Addressing Thermal Challenges in High‐Density Power Applications
Demand for more features and higher performance from ever-smaller form factors presents significant challenges...
Solar Array Simulator Helps Get JWST and Other Satellites Into Orbit
NASA's James Webb Space Telescope (JWST), is high-profile, but just one of many satellites that launch...
MTBF: misquoted and misunderstood
Reliability is one of the most important factors that a designer needs to consider when specifying components...
SubLVDS to MIPI CSI-2 Image Sensor Interface Bridge Soft IP
Many Image Signal Processor (ISP) or Application Processors (AP) use the Mobile Industry Processor Interface...
Advantages and Challenges of Third-Overtone IC Crystals
ICs with on-board oscillators requiring low frequency fundamental crystals are commonplace but now IC...
B+B SmartWorx IXM™ TECHNOLOGY, the Master to Network Deployment
In traditional networking management, it can take a lot of time to configure each network device with...
EMC Test Solutions on The Cutting Edge
Upcoming technologies such as 5G for wireless communications and the increasing amount of integrated...
Hi-pot Type Testing Application Note
This Application Note was written to provide insight into the one time requirement for ‘type' testing...
Understanding AC/DC power supply efficiency – the hot topic
The drive for smaller power supplies goes handin hand with a need for greater efficiency. There' s a...
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