Latest Whitepapers
New Open LED Shunt Protection (LSP) Devices
As LEDs continue to penetrate a wide range of diverse market sectors and become the preferred means of...
TruST25 Digital signature Authenticity with ST25 NFC/RFID tags
Discover how NFC/RFID tags with an embedded digital signature eliminate the risk of counterfeit and gray...
The problems with tinning wires
Many companies and manufacturers use the practice of solder-dipping wire ends, but this can lead to loose...
MTBF: misquoted and misunderstood
Reliability is one of the most important factors that a designer needs to consider when specifying components...
Evolution of Weatherproofing Solutions for the Cell Site
Weatherproofing options for coaxial connections at cell sites have changed and expanded along with the...
Solid-State Drives in Embedded Systems
Typical rotating media is perceived to be among the most significant causes of machine downtime in industrial...
Increasing Density in Defense Electronic
Defense development technologies and strategies are locked into an international race for dominance,...
Enabling Multi-Host System Designs with PCI Express Technology
Although not part of the PCI Express spec, nontransparent bridging is completely consistent with it and...
Application Tips – General Purpose Batteries
Metal holders with spring retainer arms can cause inadvertent charging or short circuits. Isolation of...
eGaN® FET Drivers and Layout Considerations
When considering gate drive requirements, the three most important parameters for eGaN FETs are (1) the...
High Pulse Resistors
Resistors used in modern electronics often experience transients (e.g. lighning strike) or pulse loads...
Comparison of jitter measurements in the time and frequency domain
When analyzing the robustness of data transmission systems, jitter is a key indicator. It is recommended...
How do you ready a solder pot for lead-free solder?
It is important to first insure the solder is lead-free solder compatible. High tin alloys tend to leach...
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