Industrial

ECC vs. Non-ECC MEMORY
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...

350V to12V DC “Yeaman Topology” Power System
This paper introduces a new DC/DC power supply architecture, called “Yeaman Topology”. The main characteristic...

MEMORY MODULE SERIAL PRESENCE DETECT (SPD)
For a computer system to recognize a memory module, the module needs to have a chip on it that communicates...

How To Select the Right IoT Platform
Although it has been with us in some form and under different names for many years, the Internet of Things...

Moving Beyond Zigbee® for Star Networks
Multi-hop mesh protocols, such as Zigbee® , are getting a lot of press for their ability to link together...

Signal Model Based Approach to Joint Jitter and Noise Decomposition
In this whitepaper, Rohde and Schwarz introduces a joint jitter and noise analysis framework for serial...

Thermal Clad®
Fabrication of Thermal Clad is similar to traditional FR-4 circuit boards with regard to imaging and...

Seven Common KPIs for Production Monitoring
To help improve processes, drive productivity and maintain a competitive edge in today's global economy,...

Keeping up with wireless protocols
The electronics industry never sleeps. Technical evolution drives the beating heart of the global industry...

Pushing Hall Effect Technology to New Limits
Reducing energy consumption and improving efficiency are targeted outcomes for most power electronics...

Toggle and Spin-Torque MRAM: Status and Outlook
Everspin Technologies review the development of MRAM technology at Everspin, focusing on both toggle...
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